Service Plan
2 and 3 Year Service Plans
provide an additional 2/3
years of product protection beyond the manufacturer's labor warranty
You Don't Pay for Repairs!
Product Care Plans cover 100% parts & labor costs for:
- Mechanical and Electrical Failures
- Damage from Power Surges
- Normal Wear & Tear Failures
- Damage Caused by Environmental Factors
The Plan Covers Common Repairs Including:
- Plasma TV Driver Boards
- Remote Controls
- and more!
Product Care Plans Provide FREE Annual Cleaning and Adjust
Professional clean and adjust service for TV/DVD or TV/VCR combos are FREE for each year of coverage.
Remote Controls are Covered
We will repair or replace failed remote controls.
In-Home/On-Site Service Available
Qualified products, mirroring the manufacturer's warranty, receive convenient in-home or on-site service.
Transferable
If you sell your product or give it as a gift, the Product Care Plan is transferable to the new owner.
Product Care Plans Provide a "No Lemon Guarantee"
If your product fails three times for the same reason, on the fourth repair it will be replaced.
Obtaining Service is Easy!
Dial 1-877-968-6391 24 hours a day, 365 days a year to obtain service from a network of over 25,000 service centers nationwide.
At this time, Service Plans are unavailable for purchase in American Samoa, Federated States of Micronesia, Marshall Islands, Northern Mariana Islands and Palau.
Click here for Terms and Conditions for all states.
You will need Adobe Acrobat Reader to view Terms and Conditions.
Download Adobe Acrobat Reader now.
Welding for Collision Repair by Larry F. Jeffus, ISBN 0766809668
Plasma > Welding for Collision Repair by Larry F. Jeffus, ISBN 0766809668
Integrated Circuit Failure Analysis: A Guide to Preparation Techniques by Friedrich Beck, ISBN 0471974013
Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. Advice on the choice of suitable laboratory equipment. Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text...
Integrated Circuit Failure Analysis: A Guide to Preparation Techniques by Friedrich Beck, ISBN 0471974013
Plasma > Integrated Circuit Failure Analysis: A Guide to Preparation Techniques by Friedrich Beck, ISBN 0471974013